The company uses direct “gas-to-wafer” epitaxial technology to produce its solar wafers which achieved 24.4% efficiency on ...

Laser ablation results in smaller chipping on both the top and bottom sides of the die, as well as a narrower kerf width.

Today we're exploring different properties and parameters involved with cutting silicon with a pulsed nanosecond laser ...

The German wafer manufacturer said the result was achieved with an unspecified M6 HJT commercial production line, without ...

Key Apple partner Foxconn has announced that it expects to begin mass production of its first microLED screens late next year. These are tiny displays destined for a future AR headset. Hon Hai ...

Peters. GlobalWafers makes silicon wafers used in chip manufacturing. Mark England, president of GlobalWafers Co., said in a ...

N2 NanoFlex and GAA nanosheet transistors make TSMC’s 1.15x increase in chip density possible. The gate-all-around tech marks ...