The company uses direct “gas-to-wafer” epitaxial technology to produce its solar wafers which achieved 24.4% efficiency on ...

Laser ablation results in smaller chipping on both the top and bottom sides of the die, as well as a narrower kerf width.

The German wafer manufacturer said the result was achieved with an unspecified M6 HJT commercial production line, without ...

The light activates a photoresist on the surface, which allows the etching of a pattern on the wafer. Through successive iterations of photolithography and the deposition of metals, devices with ...

But there is a catch. TSMC's quote for a 300-mm wafer process using its N2 technology will exceed $30,000, according to the report. Previously it was expected that world's largest contract maker ...

The company also announced an even more ambitious technology named System-on-Wafer (SoW) that will allow for 3D stacking of logic and memory directly on top of a 300mm wafer-sized chip.

Wafer-scale 2D perovskite oxides transform motion recognition with enhanced speed, precision, and scalability in ...

The data gleaned from those sensors has broad uses within the fab. It can measure process module performance, identify defect ...

N2 NanoFlex and GAA nanosheet transistors make TSMC’s 1.15x increase in chip density possible. The gate-all-around tech marks ...

Let us help you with your inquiries, brochures and pricing requirements Request A Quote Download PDF Copy Download Brochure The EVG101 resist processing system from ...