The company uses direct “gas-to-wafer” epitaxial technology to produce its solar wafers which achieved 24.4% efficiency on ...

The German wafer manufacturer said the result was achieved with an unspecified M6 HJT commercial production line, without ...

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N2 NanoFlex and GAA nanosheet transistors make TSMC’s 1.15x increase in chip density possible. The gate-all-around tech marks ...

Laser ablation results in smaller chipping on both the top and bottom sides of the die, as well as a narrower kerf width.

But there is a catch. TSMC's quote for a 300-mm wafer process using its N2 technology will exceed $30,000, according to the report. Previously it was expected that world's largest contract maker ...

NexWafe used EpiNex wafers to develop ultra-thin 70µm cells to address the growing demand for solar cells to power low earth orbit satellites. These cells exhibit radiation performance comparable to ...

The data gleaned from those sensors has broad uses within the fab. It can measure process module performance, identify defect ...

Wafer-scale 2D perovskite oxides transform motion recognition with enhanced speed, precision, and scalability in ...

The light activates a photoresist on the surface, which allows the etching of a pattern on the wafer. Through successive iterations of photolithography and the deposition of metals, devices with ...

These milestone results validate that NexWafe’s direct gas-to-wafer process as a seamless drop-in replacement for conventional CZ wafers, while offering the potential for significant cost ...