CMP slurries are used in conjunction with CMP pads or polishing naps, which are rotated and held against a substrate or wafer surface during the planarization process. Wafer planarization produces a ...

They include ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, and gold. Semiconductors / Electronics (Wafers) Compounds are formulated, designed or suitable for finishing or polishing ...