An electronic stacking method could significantly increase the number of chip transistors, improving AI hardware efficiency.

台积电（TSMC）近日正式宣布，将在2026年推出全新的共同封装光学（CPO）技术，融合其业界领先的Chip-on-Wafer-on-Substrate（CoWoS）封装技术与硅光子（Silicon Photonics）技术。此举旨在满足人工智能（AI）与高性能计算（HPC）领域对高速数据传输和低能耗的迫切需求，同时引领下一代数据中心的技术潮流。

The U.S. Commerce Department has finalized a $406 million subsidy for Taiwan’s GlobalWafers, aiming to boost domestic ...

There is a thing to note though: for now, no U.S. chipmaker processes SOI wafers in high volumes. The majority of silicon ...

Advt "We look forward to innovating with our US-based chip customers for decades to ... a $5 billion plant in Texas to make 300-mm silicon wafers used in semiconductors, switching from a defunct ...

A new way to make ultra-thin diamond wafers using sticky tape could help ... energies with greater efficiency than conventional silicon chip designs. However, producing working diamond chips ...

The U.S. Commerce Department finalized $406 million in grants for Taiwan's GlobalWafers to enhance silicon wafer production ...

The wafers are a crucial component ... its advantages at a time when the global chip supply chain faced tariffs. "In countries with high demand for silicon wafers, local supply will be prioritized ...